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WHAT'S NEW..?
NanoPhotonics releases the next generation (Gen 3) edge-inspection technology. The technology complies to the 22 nm and higher nodes where sub micron sensitivity inspection technology for both wafer edge and wafer back-side is required. The MC EBI integrated metrology module consists of the EDI Gen 3 Edge Defect Inspection module and a laser scattering BSI Back-Side Inspection module. The CCD line scan camera based EDI provides 1µm sensitivity on the wafer bevel and 0.5 µm sensitivity on top flat region of the wafer. The BSI module delivers sensitivity below 0.2 µm and haze information as well. The Bolts compatible MC EBI Gen 3 system can be integrated as an Integrated Metrology Module into a wafer sorter or process tools. Both 300 mm and 450 mm versions are available. read more

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Welcome to NanoPhotonics
NanoPhotonics provides defect inspection equipment for bare wafer surface, edge and back side. A second product line is designed for mask blank inspection and reticle back side inspection. NP’s innovative modular product architecture and strong engineering capabilities allow us to react quickly to customers’ needs.

We support our customers with standard equipment as well as custom solutions:
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OUR PRODUCTS WILL MEET YOUR REQUIREMENT FOR INSPECTION ON UNPATTERNED SUBSTRATES:

Silicon wafers from 6” to 450 mm
Mask blanks
Glass wafers Compound semiconductors

OUR TEAM PROVIDES
excellent know-how and experience
custom-configurable solutions
perfect customer support
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