NanoPhotonics releases the next generation (Gen 3) edge-inspection technology. The technology complies to the 22 nm and higher nodes where sub micron sensitivity inspection technology for both wafer edge and wafer back-side is required. The MC EBI integrated metrology module consists of the EDI Gen 3 Edge Defect Inspection module and a laser scattering BSI Back-Side Inspection module. The CCD line scan camera based EDI provides 1µm sensitivity on the wafer bevel and 0.5 µm sensitivity on top flat region of the wafer. The BSI module delivers sensitivity below 0.2 µm and haze information as well. The Bolts compatible MC EBI Gen 3 system can be integrated as an Integrated Metrology Module into a wafer sorter or process tools. Both 300 mm and 450 mm versions are available. read more