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OUR STRENGTH:
OUR STAFF!

Highly-skilled people
form a strong team:
Application
Service
Software
Engineering
Integration
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Milestones in NanoPhotonics' History
1997 NP founded
by Dr. Michael Abraham and Jan Melles.

1999 The Photonics Spectra Circle of Excellence Award
for ELLIPSON®, the world’s smallest laser ellipsometer.

2000 A strategic partnership with ASM has been
established with the vision to integrate NP’s ultra
compact thin film and defect inspection devices into
ASM's various process tools.

2001 SEMICON West introduction of Ellipsometer
integrated to a Brooks Automation sorter

2002 The first REFLEX TableTop shipped to SUESS, Munich,
as a versatile cost effectiv defect inspection system.

2003 A joint development program with a leading Wafer
manufacturer started to develop automatic wafer back
side and edge inspection technology for 300 mm wafer
manufacturing

2004 ELLIPSON MetriCube® Laser Ellipsometer integrated
to ASMJ CVD tool

2004 REFLEX AF 300 mm automatic defect inspection
system shipped to Taiwanese customer

2006 JANUS® combined defect inspection& ellipsometer
tool integrated to ASM’s A412 vertical furnace

2006 First REFLEX MC EBI systems for edge and back side
defect inspection delivered to leading wafer manufacturer

2008 200/300 mm Glass Silicon Defect Inspection tool
shipped to major back-End of line manufacturer

2008 NanoPhotonics becomes member of the Ricmar Group
www.Ricmar.com

2009 NanoPhotonics releases next generation of edge
inspection technology

450 mm surface and edge inspection tools
successfully installed at ISMI

Surface defect inspection tool shipped to US based
manufacturer of advanced PV cells

Inspection tool for mask blanks shipped to leading
manufacturer of lithography equipment

2010 NanoPhotonics developed a new High Sensitivity-65nm
Particle & Defect Detection System for Mask Blanks
and Bare Wafers. Initial tests show a clear detection of
64nm latex spheres on bare Si-Wafers. The system
features high sensitivity, high throughput at low cost.
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 OUR MISSION
Inspection Equipment
for defects on

Surface, edge and back side
of bare wafers

Mask blanks

Glass and compound
semiconductors
NOTEWORTHY FACTS

President: Dr. M. Abraham

R&D, assembly and test

Own class 100/10 cleanroom

Worldwide customer support

Integration and engineering services
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