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Front view (left) and back view of MetriCube® enclosure for edge and back side inspection
Front view (left) and back view of MetriCube® enclosure for edge and back side inspection

Defect map (left) and haze map (right) of a Si wafer back side
Defect map (left) and haze map (right)
of a Si wafer back side
User Interface for Edge Inspection
User Interface for Edge Inspection

 

MetriCube® MC EBI Edge and Back Side Inspection Module

Description

The MC EBI combines the back side wafer defect inspection module and the edge wafer defect inspection module in a single BOLTS compatible MetriCube enclosure for parallel operation of edge and back side wafer defect inspection. The software automatically classifies defects of the wafer back side, edge, and bevel of both wafer sides without interruption. The MC EBI enables to integrate defect inspection to third parties process, wafer sorting and metrology systems through its Bolts interface.

Benefits

  • Replaces less reliable and less sensitive visual inspection
  • Complimenting process and wafer sorting tools with inspection capability
  • 100 % dark field and bright field imaging of the wafer edge
  • Powerful Automatic Defect Classification (ADC)
  • Two functions at footprint of a load port

Applications

  • 200 mm, 300 mm Silicon wafers
  • 200 mm and 300 mm glass wafers
  • IC manufacturing for integrated fault detection and control in particle sensitive processes

 
Product overview

WAFER
Front Side Inspection (FSI)

Back Side Inspection (BSI)

Edge Defect Inspection (EDI)

Combined Edge and
Back Side Inspection (EBI)

Inspection Equipment for 450 mm Wafers

MASK BLANKS AND RETICLES
Mask Blank Inspection Equipment

PSL Calibration Wafers and Calibration Mask Blanks
ESC - Environmental and Quality Standards Certification
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