Front view (left) and back view of MetriCube® enclosure for edge and back side inspection
Defect map (left) and haze map (right) of a Si wafer back side User Interface for Edge Inspection
MetriCube® Series of Integrated Metrology Modules
Description
The MetriCube® Series of Integrated Metrology Modules enables to integrate defect inspection to third parties process, wafer sorting and metrology systems through its Bolts interface. NanoPhotonics offers the four different versions for wafer sizes up to 450 mm:
MC FSI is a laser dark field Front Side Wafer Defect Inspection moduledetecting particles, scratches, area defects, and micro-roughness (haze) on unpatterned wafers. It employs advanced diode laser illumination and a patented optical collection system for measuring the back scattered light.
MC BSI Back Side Wafer Defect Inspection module is a high sensitive dark field laser scattering system to detect particles, scratches, area defects, and haze with sensitivity up to 150 nm. The upside down configuration enables back side inspection without need to flip the wafer.
MC EDI Edge Wafer Defect Inspection module consists of a CCD camera system and a dark field/bright field LED illumination system. The MC EDI detects scratches, particles, chip-outs, and contamination on the wafer edge with 360° full scan of total wafer edge reaching 5 mm into the flat zones.
MC EBI combines the back side wafer defect inspection module and the edge wafer defect inspection module in a single BOLTS compatible MetriCube enclosure for parallel operation of edge and back side wafer defect inspection. The software automatically classifies defects of the wafer back side, edge, and bevel of both wafer sides without interruption.
Benefits
Replaces less reliable and less sensitive
visual inspection
Multiple functions in one system saving
costs and footprint
Upside down configuration to avoid wafer
flipping (back side inspection)
Applications
200 mm, 300 mm, and 450 mm Silicon Wafer
200 mm and 300 mm glass wafers
IC manufacturing for integrated fault detection and control in particle sensitive processes
