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AF FSI 300 mm Inspection System
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AF Series of
Front Side, Back Side, and Edge Defect Inspection Equipment
Description
The AF Series automated defect inspection product series for 200 mm and 300 mm unpatterned wafers. The modular system of this compact tool consists of a 300 mm automation platform with wafer transfer and sorting capability. It can be combined with up to two modules from the NanoPhotonics MetriCube series for front side edge and back side defect inspection. This flexible system can be configured to match various applications at an optimized price performance ratio. Future metrology upgrades can easily be incorporated without changing the automation platform.
Features
- 200 mm and 300 mm silicon and glass wafers
- 200 mm and 300 mm bridge tool
- Sorting capability
- Automatic defect classification
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Product overview
Front Side Inspection (FSI)
Back Side Inspection (BSI)
Edge Defect Inspection (EDI)
Combined Edge and
Back Side Inspection (EBI)
450 mm Inspection Equipment
Calibration Wafers
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