450 mm Wafer Defect Inspection Equipment

Description

• The MC 450 FSI Wafer Surface Defect Inspection Module is a dark field defect inspection system dedicated for detecting, classifying, and quantifying particles, scratches, area defects, and micro-roughness (haze) on the surface of unpatterned 450 mm wafers.
• MC 450 EDI is a wafer edge defect inspection system providing dark field and bright field images of the complete circumference of 450 mm wafers.

Both modules are 450 mm BOLTS compatible and can be attached to any 450 mm process tool. The combined system enables fully automatic inspection of 450 mm wafers and the qualification of 450 mm equipment.

The AFX 450 mm Automatic Inspection Cluster for combined front side, back side, and edge wafer defect inspection is currently under development.

Features 450 mm FSI surface inspection

• Front side inspection 450 mm wafers
• Particle sensitivity 65 nm LSE
• Powerful automatic defect classification
  (ADC)

Features 450 mm EDI edge inspection

• 2 camera system with overlapping
  measurement area
• Sensitivity (dark field) ≥ 5 µm LSE
• Field of view up to 5 mm into the wafer
• Dark field and bright field in all 5 zones
• Real time automatic defect classification software

Benefits

• Enables 450 mm process and tool development
• Flexible configurations

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