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Defect map and haze map of a GaN epitaxial layer
Monitoring a PVD tool for particle adders
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AWX FSI 200
Automated Open Cassette Wafer Defect Inspection Equipment
Description
The AWX FSI 200 automatic open cassette product series is an automated inspection tool for detecting, classifying and quantifying particles, scratches, area defects and micro-roughness (haze) on unpatterned wafers. Different wafer substrates, materials and sizes of up to 200 mm diameter can be measured. The automated handling of different open cassette types and integrated notch and flat alignment allows wide flexibility for using AWX FSI 200 in various environments.
Typical Applications
- Monitoring of thin film deposition tools for particle
contamination in Back End of Line bumping process
- Quality inspection before and after epitaxial process
for compound semiconductors in LED manufacturing
- Inspection of glass wafers before bonding
Features
- High throughput
- Particle sensitivity down to 65 nm on Silicon
- Laser dark field measurement technology
- Bridge tool capability 4“ & 6“ and 6“ & 8“
- Automatic defect classification
- Can be combined with edge defect inspection capability (200 mm)
Benefits
- Low cost of ownership
- Small footprint
- User friendly operation and GUI
Materials
- Silicon
- Glass wafers
- Compound Semiconductors
- Transparent films on Si
- Metal films
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Product overview
WAFER
Front Side Inspection (FSI)
Back Side Inspection (BSI)
Edge Defect Inspection (EDI)
Combined Edge and
Back Side Inspection (EBI)
Inspection Equipment for 450 mm Wafers
MASK BLANKS AND RETICLES
Mask Blank Inspection Equipment
PSL Calibration Wafers and Calibration Mask Blanks
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