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Defect map and haze map of a GaN epitaxial layer
Monitoring a PVD tool for particle adders
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REFLEX AC
Open Cassette Wafer Defect Inspection Equipment
Description
The REFLEX AC automatic open cassette product series is an automated inspection tool for detecting, classifying and quantifying particles, scratches, area defects and micro-roughness (haze) on unpatterned wafers. Different wafer substrates, materials and sizes of up to 200 mm diameter can be measured. The REFLEX AC can be operated as a bridge tool for two wafer sizes. The automated handling of different open cassette types and integrated notch and flat alignment allows wide flexibility for using Reflex AC in various environments that include R&D, production, and quality inspection.
Typical Applications
- Monitoring of thin film deposition tools for particle
contamination in Back End of line bumping lines
- Quality inspection before and after epitaxial process
for compound semiconductors in LED manufacturing
- Inspection of glass wafers before bonding
Features
- Compact design
- Particle sensitivity down to 65 nm
- Laser dark field measurement technology
- Bridge tool capability 4“ & 6“ and 6“ & 8“
- Integrated wafer notch / flat alignment
- Edge gripping for glass wafers
- Automatic defect classification
- Offline data visualization and analysis possible
- Good correlation to known industry standards
- Class 1 mini-environment
Benefits
- Low cost of ownership
- Small footprint
- User friendly operation and GUI
- Calibration services
Materials
- Silicon
- Glass wafers
- Compund Semiconductors: GaAs, GaN, GaAIN
- Transparent films on Si
- Metal films
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Product overview
Front Side Inspection (FSI)
Back Side Inspection (BSI)
Edge Defect Inspection (EDI)
Combined Edge and
Back Side Inspection (EBI)
450 mm Inspection Equipment
Calibration Wafers
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