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 MetriCube® MC BSI Integrated Back Side Inspection Module  Defect map (left) and haze map (right) of a Si wafer back side
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MetriCube® MC BSI Integrated Back Side Inspection ModuleDescriptionThe MC BSI Back Side Wafer Defect Inspection module is a high sensitive dark field laser scattering system to detect particles, scratches, area defects, and haze with sensitivity up to 150 nm. The upside down configuration enables back side inspection without need to flip the wafer. The MC BSI enables to integrate defect inspection to third parties process, wafer sorting and metrology systems through its Bolts interface.Benefits
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