NanoPhotonics - Surface inspection and edge inspection on bare semiconductor wafers
NanoPhotonics - Homepage COMPANY PRODUCTS SUPPORT NEWS JOBS CONTACT

BevelCam TT Table Top
BevelCam TT Table Top
User interface for edge inspection
User Interface for Edge Inspection

BevelCam TT – Manually Loaded Edge Wafer Defect Inspection

Description

The BevelCam TT edge wafer defect inspection tool consists of a CCD camera system and a dark field/bright field LED illumination system. The BevelCam TT delivers information about scratches, particles, chip-outs, and contamination on the wafer edge, front & back bevels, and into 5 mm of the wafer front and back surfaces. The ADC software automatically classifies defects in these five regions without interruption.

Features

  • CCD edge inspection with 360° full scan of total wafer edge reaching 5 mm into the flat zones
  • Notch defects
  • Real time Automatic Defect Classification (ADC)
  • True edge gripping or back side handling

Benefits

  • Ideal tool for process development
  • User friendly operation and GUI
  • Use for different applications
  • Small footprint

Applications

  • Silicon
  • Glass

 


Product overview

Front Side Inspection (FSI)

Back Side Inspection (BSI)

Edge Defect Inspection (EDI)

Combined Edge and
Back Side Inspection (EBI)

450 mm Inspection Equipment

Calibration Wafers

 

ESC - Environmental and Quality Standards Certification
Sitemap Imprint / Disclaimer
Copyright © 2010 NanoPhotonics GmbH. All rights reserved.