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BevelCam TT Table Top

User Interface for Edge Inspection
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BevelCam TT – Manually Loaded Edge Wafer Defect Inspection
Description
The BevelCam TT edge wafer defect inspection tool consists of a CCD camera system and a dark field/bright field LED illumination system. The BevelCam TT delivers information about scratches, particles, chip-outs, and contamination on the wafer edge, front & back bevels, and into 5 mm of the wafer front and back surfaces. The ADC software automatically classifies defects in these five regions without interruption.
Features
- CCD edge inspection with 360° full scan of total wafer edge reaching 5 mm into the flat zones
- Notch defects
- Real time Automatic Defect Classification (ADC)
- True edge gripping or back side handling
Benefits
- Ideal tool for process development
- User friendly operation and GUI
- Use for different applications
- Small footprint
Applications
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Product overview
Front Side Inspection (FSI)
Back Side Inspection (BSI)
Edge Defect Inspection (EDI)
Combined Edge and
Back Side Inspection (EBI)
450 mm Inspection Equipment
Calibration Wafers
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