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BevelCam TT Table Top

User Interface for Edge Inspection
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BevelCam TT – Manually Loaded Edge Wafer Defect Inspection
Description
The BevelCam TT edge wafer defect inspection tool consists of a CCD camera system and a dark field/bright field LED illumination system. The BevelCam TT delivers information about scratches, particles, chip-outs, and contamination on the wafer edge, front & back bevels, and into 5 mm of the wafer front and back surfaces. The ADC software automatically classifies defects in these five regions without interruption.
Features
- 200 mm, 300 mm Wafers
- CCD edge inspection with 360° full scan of total wafer edge reaching 5 mm into the flat zones
- Notch defects
- Real time Automatic Defect Classification (ADC)
- True edge gripping or back side handling
Benefits
- Ideal tool for process development
- User friendly operation and GUI
- Use for different applications
- Small footprint
Applications
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Product overview
WAFER
Front Side Inspection (FSI)
Back Side Inspection (BSI)
Edge Defect Inspection (EDI)
Combined Edge and
Back Side Inspection (EBI)
Inspection Equipment for 450 mm Wafers
MASK BLANKS AND RETICLES
Mask Blank Inspection Equipment
PSL Calibration Wafers and Calibration Mask Blanks
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