The MC EDI Edge Defect Inspection module consists of a CCD camera system and a dark field/bright field LED illumination system. The MC EDI detects scratches, particles, chip-outs, and contamination on the wafer edge with 360° full scan of total wafer edge reaching 5 mm into the flat zones. The MC EDI enables to integrate defect inspection to third parties process, wafer sorting and metrology systems through its Bolts interface.
Benefits
Replaces less reliable and less sensitive
visual inspection
Complimenting process and wafer sorting tools with inspection capability
100 % dark field and bright field imaging of the wafer edge
Powerful Automatic Defect Classification (ADC)
Applications
200 mm, 300 mm and 450 mm Silicon wafers
200 mm and 300 mm glass wafers
IC manufacturing for integrated fault detection and control in particle sensitive processes
