NanoPhotonics - Surface inspection and edge inspection on bare semiconductor wafers
NanoPhotonics - Homepage COMPANY PRODUCTS SUPPORT NEWS JOBS CONTACT
AF Series automatic FOUP type 300 mm wafer defect inspection tool

Custom-configurable Stand-alone equipment for front side inspection, edge inspection, and back side inspection on 200, 300, and 450 mm wafers. Integrated Metrology Modules of the companies MetriCube® series for integration to process tools and wafer sorters. 


MetriCube integrated module (IMM) for surface, edge, and/or back side wafer defect inspection

NanoPhotonics AWX 200

 

Automated wafer defect inspection and mask blank inspection tools with automatic open cassette platform for using it in various R&D and production environments. Bridge tool capability 4” & 6” and 6” & 8” wafers.

 

TT series table top manually operated wafer and mask blank defect inspection tool
Manually loaded table top wafer and mask blank defect inspection tool for front side and edge inspection on wafers from 2” up to 300 mm and mask blanks for process development, R&D, application labs, and tool qualification.

Product overview

WAFER
Front Side Inspection (FSI)

Back Side Inspection (BSI)

Edge Defect Inspection (EDI)

Combined Edge and
Back Side Inspection (EBI)

Inspection Equipment for 450 mm Wafers

MASK BLANKS AND RETICLES
Mask Blank Inspection Equipment

PSL Calibration Wafers and Calibration Mask Blanks

 

DOWNLOAD PRODUCT FLYERS

 
ESC - Environmental and Quality Standards Certification
Sitemap Imprint / Disclaimer
Copyright © 2012 NanoPhotonics GmbH. All rights reserved.