NanoPhotonics - Surface inspection and edge inspection on bare semiconductor wafers
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AF Series automatic FOUP type 300 mm wafer defect inspection tool

Equipment for

front side inspection, edge inspection, and back side inspection on 200, 300, and 450 mm Wafers

housed in autonomous MetriCube® enclosure are the basis for automatic stand-alone applications or metrology integration into other tools and wafer logistic systems.


MetriCube integrated module (IMM) for surface, edge, and/or back side wafer defect inspection
AC series automatic open cassette wafer defect inspection tool 4”- 8” wafers
Automated wafer defect inspection tools with automatic open cassette platform for using it in various R&D and production environments. Bridge tool capability 4” & 6” and 6” & 8” wafers.

TT series table top manually operated wafer and mask blank defect inspection tool
Manually loaded table top wafer and mask blank defect inspection tool for front side and edge inspection on wafers from 2” up to 300 mm and mask blanks for process development, R&D, application labs, and tool qualification.

Product overview

Front Side Inspection (FSI)

Back Side Inspection (BSI)

Edge Defect Inspection (EDI)

Combined Edge and
Back Side Inspection (EBI)

450 mm Inspection Equipment

Calibration Wafers

ESC - Environmental and Quality Standards Certification
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